板级光互连模块BGA焊点温振耦合应力应变有限元分析

华建威; 黄春跃; 梁颖; 黄伟; 张龙

doi:10.16579/j.issn.1001.9669.2018.04.028

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板级光互连模块BGA焊点温振耦合应力应变有限元分析

焊接·铸造·锻压·热材料 | 更新时间：2022-09-22

- 板级光互连模块BGA焊点温振耦合应力应变有限元分析
- FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION
- 机械强度 2018年40卷第4期页码：938-942
- 作者机构：
  
  1. 桂林电子科技大学机电工程学院
  2. 成都航空职业技术学院电子工程系
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006)资助~~
- DOI：10.16579/j.issn.1001.9669.2018.04.028
  中图分类号：
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华建威, 黄春跃, 梁颖, 等. 板级光互连模块BGA焊点温振耦合应力应变有限元分析[J]. 机械强度, 2018,40(4):938-942.

HUA JianWei, HUANG ChunYue, LIANG Ying, et al. FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION[J]. 2018,40(4):938-942.
华建威, 黄春跃, 梁颖, 等. 板级光互连模块BGA焊点温振耦合应力应变有限元分析[J]. 机械强度, 2018,40(4):938-942. DOI： 10.16579/j.issn.1001.9669.2018.04.028.

HUA JianWei, HUANG ChunYue, LIANG Ying, et al. FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION[J]. 2018,40(4):938-942. DOI： 10.16579/j.issn.1001.9669.2018.04.028.

摘要

基于Ansys软件建立了板级光互连模块有限元模型,并对模型进行了温振耦合加载分析,获取了耦合条件下应力应变的数据,分析了焊点高度、焊盘直径和焊球体积三种焊点形态参数的变化对焊点应力应变的影响。结果表明:焊点阵列内应力应变由中间位置处焊点向两端边角处焊点逐渐增大;最大应力应变出现于焊点阵列边角处的焊点上;随着焊点高度的增加,焊点阵列的最大应力应变逐渐增大,随着焊盘直径增大和焊球体积的增加,最大应力应变逐渐减小。

Abstract

Based on ANSYS software established board level optical interconnect module finite element model,by means of the analysis of the model of the thermal-structure random vibration coupling,obtained the data of stress and strain under the coupling condition,analyzed the influence of the change of the shape parameters of three kinds of solder joints,the height of the solder joints,the diameter of the pad and the volume of the solder balls.The results show that the stress and strain value of the solder joint is gradually reduced from the center position to the solder joint at both ends;the maximum stress and strain point appeared in the solder joint at the corner of the array.With the increase of the solder joint height,the maximum stress and strain of the solder joint increased gradually.With the increase of the diameter of the pad and the volume of the solder ball,the maximum stress and strain decreased gradually.

关键词

光互连温振耦合分析焊点阵列应力应变有限元分析

Keywords

Optical interconnectionThermal vibration coupling analysisSolder joint arrayStress and strainFinite element analysis

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