OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM

CHEN YuLong; LI ShuJuan; BU WenHao; WANG XinYi

doi:10.16579/j.issn.1001.9669.2019.01.017

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OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM

更新时间：2022-09-22

- OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM
- Journal of Mechanical Strength Vol. 41, Issue 1, Pages: 98-103(2019)
- 作者机构：
  
  1. 西安理工大学机械与精密仪器工程学院
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2019.01.017
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CHEN YuLong, LI ShuJuan, BU WenHao, et al. OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM. [J]. 41(1):98-103(2019)
DOI：

CHEN YuLong, LI ShuJuan, BU WenHao, et al. OPTIMIZE PROCESS OF WEDM MONOCRYSTALLINE SILICON BASE ON RESPONSE SUEFACE METHOD AND IMPROVED NON-DOMINATED GENETIC ALGORITHM. [J]. 41(1):98-103(2019) DOI： 10.16579/j.issn.1001.9669.2019.01.017.

摘要

单晶硅加工过程中追求切削效率与表面质量既可以提高晶圆自身品质又可以降低生产成本。通过响应曲面法(RSM)建立关于输入参数电压、脉宽、脉间、线锯速度与工艺结果的二阶模型,方差分析表明模型方程可行性。运用改进非支配遗传算法(NSGA-II)对加工工艺进行优化可以得到一组关于工艺结果的非支配解,这些非支配解可以满足不同条件下工程加工者的需要。进行相应实验验证非支配解可行。

Abstract

Pursuiting cutting efficiency and surface quality during machining monocrystalline silicon can improve the quality of the wafer itself and reduce the production cost. The second-order model of variable parameter voltage,pulse on time,pulse interval,wire saw speed and process result is established by response surface method,The variance analysis shows that the model equation is significant. The improved non-dominated genetic algorithm（ NSGA-II） is used to optimize processing process,and we can get a set of non-dominated solutions. These non-dominated solutions can satisfy the needs of engineering workers under different conditions. The corresponding experimental proving the non-dominated solution is feasible.

关键词

电火花线切割单晶硅响应曲面法NSGA-Ⅱ

Keywords

Wire electrical discharge machiningMonocrystalline siliconResponse surface methodNSGA Ⅱ

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Institute of Technology,Xi’an University of Technology

Xi’an Modern Control Technology Research Institute

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