EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER

GUO HuiYu; WEN Feng; KANG Qiang; SHI YunBo; WANG YanYang

doi:10.16579/j.issn.1001.9669.2018.01.015

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EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER

更新时间：2022-09-22

- EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER
- Journal of Mechanical Strength Vol. 40, Issue 1, Pages: 83-87(2018)
- 作者机构：
  
  1. 中北大学仪器科学与动态测试教育部重点实验室
  2. 中北大学电子测试技术国防科技重点实验室
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2018.01.015
  CLC：
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GUO HuiYu, WEN Feng, KANG Qiang, et al. EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER. [J]. 40(1):83-87(2018)
DOI：

GUO HuiYu, WEN Feng, KANG Qiang, et al. EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER. [J]. 40(1):83-87(2018) DOI： 10.16579/j.issn.1001.9669.2018.01.015.

摘要

贴片工艺是高量程MEMS加速度传感器封装工艺中一个非常重要的环节,对传感器的灵敏度和可靠性具有重要的影响。根据一种自制的、量程为XX的高量程MEMS加速度传感器的贴片封装模式,利用有限元分析法建立了传感器的贴片封装模型,基于理论、有限元方法研究了贴片胶弹性模量对传感器性能的影响。使用两种不同弹性模量的贴片胶对传感器进行了封装,开展了基于霍普金森压杆测试系统的传感器性能测试试验。模拟和试验结果表明:对于使用贴片封装模式的高量程MEMS传感器,其灵敏度随着贴片胶弹性模量的增加而相应的提高。

Abstract

The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with different elasticity modulus. The effect of the die adhesive on the performances has been studied by using finite element analysis（ FEA） and Hopkinson pressure bar measurement system simultaneously. With the consistent package process,we have experimentally demonstrated that the characteristic of dynamic sensitivity for the prepared MEMS high-g accelerometers increases with the increasing of elasticity modulus of the die attach adhesives. From this result,it is possible to fabricate MEMS high-g accelerometer with bigger sensitivity by applying die attach adhesive with bigger elasticity modulus.

关键词

封装贴片工艺高量程MEMS加速度传感器弹性模量有限元分析霍普金森杆

Keywords

PackagingDie processHigh-g MEMS accelerometerElastic modulusFinite element analysis（FEA）Hopkinson Bar

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