MICROSTRUCTURE AND PROPERTIES OF THE CU/CNTS COMPOSITE MATERIAL

FU ShaoLi; LI ShengJuan; LIU Ping; CHEN XiaoHong; LIU XinKuan; LI Wei

doi:10.16579/j.issn.1001.9669.2017.06.018

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MICROSTRUCTURE AND PROPERTIES OF THE CU/CNTS COMPOSITE MATERIAL

更新时间：2022-09-22

- MICROSTRUCTURE AND PROPERTIES OF THE CU/CNTS COMPOSITE MATERIAL
- Journal of Mechanical Strength Vol. 39, Issue 6, Pages: 1360-1365(2017)
- 作者机构：
  
  1. 上海理工大学材料科学与工程学院
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2017.06.018
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FU ShaoLi, LI ShengJuan, LIU Ping, et al. MICROSTRUCTURE AND PROPERTIES OF THE CU/CNTS COMPOSITE MATERIAL. [J]. 39(6):1360-1365(2017)
DOI：

FU ShaoLi, LI ShengJuan, LIU Ping, et al. MICROSTRUCTURE AND PROPERTIES OF THE CU/CNTS COMPOSITE MATERIAL. [J]. 39(6):1360-1365(2017) DOI： 10.16579/j.issn.1001.9669.2017.06.018.

摘要

在原位合成分布均匀的Cu/CNTs复合粉末的基础上,采用烧结温度为650℃,加载压力为35 MPa,保温时间为10 min的放电等离子烧结(SPS)工艺制备了Cu/CNTs复合材料。并对含有不同含量的Cu/CNTs复合粉末的Cu/CNTs复合材料的微观组织和性能进行研究。结果表明,当Cu/CNTs复合材料中的Cu/CNTs复合粉末含量为20%时,CNTs沿晶界均匀分布于铜基体中,形成具有一定结合力的CNTs-Cu界面,复合材料的导电率、硬度值和抗拉强度分别为82.8%IACS、96.4HV、417 MPa,且硬度、抗拉强度达到最大。

Abstract

Based on the synthesis of well-distributed Cu/CNTs composite powder,Cu/CNTs composite material was prepared by spark plasma sintering（ SPS）,and the sintering temperature is 650℃,the sintering pressure is 35 Mpa,the holding time is 10 min. We studied the microstructure and properties of Cu/CNTs composite material for various content of Cu/CNTs powder. The results show that CNTs distributed uniformly along the grain boundary in copper matrix and the CNTs-Cu interface with a certain binding force is formed and the conductivity、hardness、tensile strength are 82. 8% IACS、96. 4 HV、417 MPa,and the hardness as well as tensile strength are maximum when the percent of Cu/CNTs powder is 20%.

关键词

Cu/CNTs复合材料组织导电率力学性能

Keywords

Cu/CNTs composite materialMicrostructureConductivityMechanical properties

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