STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE

CHENG Lei; ZHOU DeJian; WU ZhaoHua

doi:10.16579/j.issn.1001.9669.2017.04.028

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STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE

更新时间：2022-09-22

- STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE
- Journal of Mechanical Strength Vol. 39, Issue 4, Pages: 904-908(2017)
- 作者机构：
  
  1. 西安电子科技大学机电工程学院
  2. 桂林电子科技大学机电工程学院
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2017.04.028
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CHENG Lei, ZHOU DeJian, WU ZhaoHua. STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE. [J]. 39(4):904-908(2017)
DOI：

CHENG Lei, ZHOU DeJian, WU ZhaoHua. STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE. [J]. 39(4):904-908(2017) DOI： 10.16579/j.issn.1001.9669.2017.04.028.

摘要

研究热循环加载对光电互联印制电路板(Printed Circuit Board,PCB)可靠性的影响。在光电互联PCB的设计阶段,建立光电互联PCB的三维有限元模型,在GJB 150.5—86规定的热循环加载条件下,对光电互联PCB焊点的可靠性、光耦合效率和光纤带的可靠性进行了研究。分析表明,光电互联PCB焊点最大应力、光纤最大应力均处于安全区域,结构不会发生破坏,且光电耦合效率不会发生显著变化,保证了光传输的稳定性。研究验证了设计方案的可行性,促进了光电互联技术的工程化。

Abstract

The influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading which defined by GJB 150.5-86.The influence includes solder joints reliability of optoelectronic PCB,optical coupling efficiency and optical fiber reliability.The following results are obtained.First,the maximum stress of solder joint and optical fiber ribbon is in the security range and the structure is not destroyed.Second,photoelectric coupling efficiency is not changed significantly,which guarantees the stability of the optical transmission.It proves the feasibility of the design scheme and promotes the engineering applications of photoelectric interconnection technology.

关键词

光电互联PCB热循环有限元分析可靠性

Keywords

Photoelectric PCBThermal cycleFinite element analysisReliability

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