STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE

LIN XunChao; LIANG Ying

doi:10.16579/j.issn.1001.9669.2016.04.029

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STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE

更新时间：2022-09-22

- STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE
- Journal of Mechanical Strength Vol. 38, Issue 4, Pages: 828-832(2016)
- 作者机构：
  
  1. 成都航空职业技术学院科技处
  2. 成都航空职业技术学院电子工程系
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2016.04.029
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LIN XunChao, LIANG Ying. STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE. [J]. 38(4):828-832(2016)
DOI：

LIN XunChao, LIANG Ying. STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE. [J]. 38(4):828-832(2016) DOI： 10.16579/j.issn.1001.9669.2016.04.029.

摘要

建立了片式元器件无焊缝焊点有限元分析模型,研究了热循环加载条件下焊盘长度、焊盘宽度、焊点体积和焊点材料对焊点热循环应力应变的影响。结果表明:热循环加载条件下,片式元器件无焊缝焊点内的应力应变大于有焊缝焊点;在只单一改变焊盘长度、焊盘宽度和焊点体积的前提下,无焊缝焊点内的最大应力应变随焊盘长度和焊点体积的增大而增大、随焊盘宽度的增大而减小;对于Sn63Pb37、Sn62Pb36Ag2、SAC305和SAC387这四种焊料,采用无铅焊料SAC305的无焊缝焊点内的最大应力应变最小。

Abstract

The chip component no-fillet solder joints finite element analysis models were set up. The influences of pad length,pad width,solder joint volume and solder joint material on the stress and strain distribution on no-fillet solder joints were analyzed under the thermal cyclic loading. The results show that the maximum strain and strain distribution in the chip component no-fillet solder joint are larger than that of the chip component solder joint with the fillet. On the condition of only changing the pad length,pad width,solder joint volume respectively,the maximum stress and strain in the chip component no-fillet solder joint increase with the increase of the pad length and the solder joint volume respectively,whereas reduce with the increase of the pad width. For the solder joint material of Sn63Pb37,Sn62Pb36Ag2,SAC305 and SAC387,the lead free SAC305 no-fillet solder joint has the minimum stress and strain under the same condition.

关键词

片式元器件高密度组装无焊缝焊点有限元模型热循环加载

Keywords

Chip componentHigh-density assemblyNo-fillet solder jointFinite element modelThermal cycle load

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