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WASTE PRINTED CIRCUIT BOARDS DISASSEMBLY DEVICE DESIGN AND CUTTER PARAMETER OPTIMIZATION
更新时间:2022-09-22
    • WASTE PRINTED CIRCUIT BOARDS DISASSEMBLY DEVICE DESIGN AND CUTTER PARAMETER OPTIMIZATION

    • Journal of Mechanical Strength   Vol. 38, Issue 4, Pages: 765-771(2016)
    • 作者机构:

      1. 南华大学机械工程学院

      2. 湖南省核燃料循环技术与装备协同创新中心

    • DOI:10.16579/j.issn.1001.9669.2016.04.018    

      CLC:

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  • TANG DeWen, HE ZhiFeng, XIE YuPeng, et al. WASTE PRINTED CIRCUIT BOARDS DISASSEMBLY DEVICE DESIGN AND CUTTER PARAMETER OPTIMIZATION. [J]. 38(4):765-771(2016) DOI: 10.16579/j.issn.1001.9669.2016.04.018.

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