ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY

REN Chao; SHAO Jiang; ZENG ChenHui; XUE HePing

doi:10.16579/j.issn.1001.9669.2016.03.030

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ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY

更新时间：2022-09-22

- ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY
- Journal of Mechanical Strength Vol. 38, Issue 3, Pages: 591-595(2016)
- 作者机构：
  
  1. 中国航空综合技术研究所航空综合环境重点实验室
- 作者简介：
- 基金信息：
- DOI：10.16579/j.issn.1001.9669.2016.03.030
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REN Chao, SHAO Jiang, ZENG ChenHui, et al. ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY. [J]. 38(3):591-595(2016)
DOI：

REN Chao, SHAO Jiang, ZENG ChenHui, et al. ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY. [J]. 38(3):591-595(2016) DOI： 10.16579/j.issn.1001.9669.2016.03.030.

摘要

基于有限元方法,建立了小外形封装((Small Outline Package,SOP)三维模型,分析了热循环载荷下5种引脚结构对焊料变形和应力应变情况的影响,对互连可靠性进行了评估,并选取3种试验样件进行热循环试验,对数值模型进行了验证分析。试验和模拟结果均表明,引脚结构与封装互连可靠性密切相关,二次成型的引脚能够有效地降低焊料变形和应力水平,其中较小的弯曲半径、较高的引脚高度效果最优,数值计算和实物试验结果吻合,数值模型能够准确地反映产品的实际情况。

Abstract

3-D finite element models of SOP（ Small Outline Package） were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately.

关键词

引脚结构有限元法SOP可靠性

Keywords

Lead shapeFinite element methodSmall outline package（SOP）Reliability

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