您当前的位置:
首页 >
文章列表页 >
THE ELECTRONIC EQUIPMENT MODAL ANALYSIS BASED ON THE SUB-STRUCTURE
更新时间:2022-09-22
    • THE ELECTRONIC EQUIPMENT MODAL ANALYSIS BASED ON THE SUB-STRUCTURE

    • Journal of Mechanical Strength   Vol. 37, Issue 4, Pages: 790-792(2015)
    • 作者机构:

      1. 西南石油大学应用技术学院

      2. 西南石油大学化学化工学院

      3. 山西师范大学物理与信息工程学院

    • DOI:10.16579/j.issn.1001.9669.2015.04.037    

      CLC:

    扫 描 看 全 文

  • CHAI GuoDong, WANG ShunHui, CHAI GuoQiang. THE ELECTRONIC EQUIPMENT MODAL ANALYSIS BASED ON THE SUB-STRUCTURE. [J]. 37(4):790-792(2015) DOI: 10.16579/j.issn.1001.9669.2015.04.037.

  •  

0

Views

113

下载量

2

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

ANALYSIS AND OPTIMIZATION OF DYNAMIC OUTPUT SHAFT STRUCTURE BASED ON FINITE ELEMENT METHOD
STRUCTURAL DYNAMIC DESIGN AND TEST VALIDATION OF VIBRATION TEST FIXTURES
UN R127 PEDESTRIAN PROTECTION ANALYSIS AND OPTIMIZATION OF THE VEHICLE
EVALUATION FOR REMAINING LIFE OF BRIDGE CRANE BASED ON RADIAL BASIS NEURAL NETWORK
VIBRATION MODAL CHARACTERISTICS OF THE HIGH-PRECISION RV REDUCER CONSIDERING MESH STATE

Related Author

No data

Related Institution

Gear Engineering Technology Center,Zhengzhou Research of Mechanical Engineering Co.,Ltd.
School of Ocean Science and Technology,Dalian University of Technology
AVIC Nanjing Engineering Institute of Aircraft Systems
Faw Haima Automobile Co.,Ltd.
Department of Industry and Information Engineering,Vocational Technology College of Hainan
0